GLIDCOP AL-25 FIRST WALL PLATES - IG1 GRADE COMPARED TO IG0

R. R. Solomon, J. D. Troxell, A. V. Nadkarni, F. Wolfe

OMG Americas (formerly SCM Metal Products, Inc.)
Research Triangle Park, NC, 27709, USA

GlidCop is copper that is dispersion strengthened with aluminum oxide, and is commercially produced and sold by OMG Americas. This powder metallurgy copper system has a unique combination of strength and conductivity characteristics, annealing resistance up to 1050 deg C, and resistance to neutron irradiation damage due to the stable ultrafine dispersion of aluminum oxide particles within the copper matrix. This has made GlidCop a primary candidate for ITER applications requiring copper alloys, including FIRST WALL and DIVERTOR components.

GlidCop AL-25 IG0 grade was developed and established in a cooperative effort between CEA and OMG to define the base properties for GlidCop plates made in the size range required for FIRST WALL modules. IG0 defines the process to make plates in thicknesses of 10, 20, 30, and 40mm and widths up to 1 meter and lengths up to 1.5 meters. IG0 process includes producing such plates DECLAD (the pure copper remnant of the extrusion canister removed) and ANNEALED AT 1000 deg C to simulate the assembly conditions (either HIP or BRAZE) for the plates when fabricated as part of the FIRST WALL modules. This also provides a uniform condition so all parties who test IG0 plates have plates made per the same thermo-mechanical history.

GlidCop IG1 is a variant of the IG0 process developed for the long term commercial supply of plates for FIRST WALL. The current production sequence for the IG1 plates is the same as the IG0 plates, except IG1 plates are supplied CLAD (the pure copper remnant of the extrusion canister is not removed) and NOT ANNEALED. The copper cladding is left on the IG1 plates to protect the core GlidCop material from oxidation and damage during rolling and handling. Annealing is eliminated because the IG1 plates will experience temperatures in the 1000(C range during assembly, thus annealing will take place during assembly. The final assembled characteristics of the IG1 plates will thus be that of the IG0 plates.

GlidCop IG1 plates have been produced and tested by OMG. Properties of IG1 plates are compared to the GlidCop IG0 properties database.